Semiconductor Process

Safety Clean Bag

• For 300 mm wafer container, High barrier, High Quality

C4F6

• High Aspect, Narrow, deep Etching

NH3

• High purity Ammonium Gas

CMP

• Shorox Cerium Oxide Slurry & Cu CMP Slurry

Espacer

• Charge dissipating agent for E-beam patterning, Photo-Mask & Nano Imprint

Super Juffit

• Solder pre-coating, Suitable for Flip Chip Bumping